Product introduction
RENA's RS 690-DW product was developed to achieve the highest silicon quality for diamond wire saws with the lowest manufacturing cost (CoO). Based on the calculation of the process parameters, the product is said to increase the output of the equipment by 15 MW/a. At the same time, the product also has the advantages of optimized wire saw shaft spacing, higher wire saw running speed, shorter cutting time, etc., to support the improvement of wafer quality and equipment output.
Targeting the problem
Reducing the cost of silicon wafers has always been a major focus of the industry, including the use of diamond wire saws that reduce kerf loss and have the potential to achieve thinner silicon wafers. However, to maximize production capacity, including wafer quality and yield, it is important to focus on controlling the overall process flow. The most important point in the acquisition cost calculation process is the cost of the coolant, which can be solved by using a suitable coolant circulation solution in the diamond wire saw process.
solution
Based on the experience of the RS 690-2 wire saw system, RENA has specially debugged the new RS 690-DW product for the diamond wire saw device. The mechanical components of the product include: a fixed wire saw with optimized wire saw shaft spacing, a new wire saw management system and a small footprint condensate dispensing circulation system. The product's process characteristics are said to achieve higher wafer quality, improved TTV (total thickness deviation) values, unit wire saw consumption of less than 1 meter, and total output of more than 15 MW/a. The machine uses a wire saw diameter of up to 100 μm when cutting 156mm x 156mm silicon wafers. Working with the SH+E Group, RENA has developed a coolant circulation system that increases coolant life and reduces process costs.
Applications
This product can be applied to the cutting process of polycrystalline/monocrystalline silicon ingots. Related Information
According to the company, the entire existing system, including electrical cabinets, covers an area of ​​only 3,701 mm x 2,000 mm, enabling a wire saw platform at the 680 mm cutting position. The system's extremely convenient operator interface (intuitive human-machine interface) and maintenance requirements are said to reduce equipment downtime.
Time to market
September 2012
RENA's RS 690-DW product was developed to achieve the highest silicon quality for diamond wire saws with the lowest manufacturing cost (CoO). Based on the calculation of the process parameters, the product is said to increase the output of the equipment by 15 MW/a. At the same time, the product also has the advantages of optimized wire saw shaft spacing, higher wire saw running speed, shorter cutting time, etc., to support the improvement of wafer quality and equipment output.
Targeting the problem
Reducing the cost of silicon wafers has always been a major focus of the industry, including the use of diamond wire saws that reduce kerf loss and have the potential to achieve thinner silicon wafers. However, to maximize production capacity, including wafer quality and yield, it is important to focus on controlling the overall process flow. The most important point in the acquisition cost calculation process is the cost of the coolant, which can be solved by using a suitable coolant circulation solution in the diamond wire saw process.
solution
Based on the experience of the RS 690-2 wire saw system, RENA has specially debugged the new RS 690-DW product for the diamond wire saw device. The mechanical components of the product include: a fixed wire saw with optimized wire saw shaft spacing, a new wire saw management system and a small footprint condensate dispensing circulation system. The product's process characteristics are said to achieve higher wafer quality, improved TTV (total thickness deviation) values, unit wire saw consumption of less than 1 meter, and total output of more than 15 MW/a. The machine uses a wire saw diameter of up to 100 μm when cutting 156mm x 156mm silicon wafers. Working with the SH+E Group, RENA has developed a coolant circulation system that increases coolant life and reduces process costs.
Applications
This product can be applied to the cutting process of polycrystalline/monocrystalline silicon ingots. Related Information
According to the company, the entire existing system, including electrical cabinets, covers an area of ​​only 3,701 mm x 2,000 mm, enabling a wire saw platform at the 680 mm cutting position. The system's extremely convenient operator interface (intuitive human-machine interface) and maintenance requirements are said to reduce equipment downtime.
Time to market
September 2012
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